Tungsten copper sheet is composed of 50% tungsten and 50% copper, combining tungsten's high melting point and strength with copper's excellent electrical and thermal conductivity. With a thickness of just 0.05mm, this alloy sheet boasts excellent high-temperature resistance, low thermal expansion coefficient, and good machinability. It is widely used in electronic packaging, RF shielding, high-power device heat dissipation, and precision electronic component manufacturing.

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